Micro ceramic parts cutted with femtosecond laser
Percision <±1µm | Surface Roughness <Ra0,1
| Item | Details |
|---|---|
| Laser Source | Femtosecond Laser (1030/515/343nm) |
| Processing Range | Planar: 500mm×500mm; Stereo: 150mm×150mm×100mm |
| Positioning Accuracy (X/Y/Z/B/C) | ≤±1μm/≤±1μm/≤±1μm/≤±5arcsec/≤±3arcsec |
| Workpiece Type | Planar, Curved Surface |
| Minimum Line Width | 3µm |
| Surface Roughness | ≤Ra0.1 |
| Dimensional Accuracy | ≤±0.5μm |
| Depth-to-Diameter Ratio Accuracy | ≤±0.3μm |
| Comprehensive Processing Accuracy | ≤±3μm |
Processing principles
High peak power femtosecond laser relies on Coulomb repulsion to break molecular bonds of materials, involving multiple complex reactions such as nonlinear photoionization and avalanche ionization.
